The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[10a-N302-1~6] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Fri. Sep 10, 2021 10:30 AM - 12:00 PM N302 (Oral)

Tatsuya Okada(Univ. of the Ryukyus)

11:15 AM - 11:30 AM

[10a-N302-4] A Single Au Proof Mass 3-Axis MEMS Accelerometer with 3D Capacitive Detection Electrode

Akira Onishi1, Akihiro Uchiyama1, Kohei Shibata1, Takashi Ichikawa1, Sangyeop Lee1, Shin-ichi Iida2, Noboru Ishihara1, Katsuyuki Machida1, Kazuya Masu1, Hiroyuki Ito1 (1.Tokyo Tech., 2.NTT-AT)

Keywords:MEMS, accelerometer, single Au proof mass

This paper describes a novel capacitive-detection electrode for a single Au proof mass three-axis MEMS (microelectromechanical systems) accelerometer. We propose a 3-D capacitive-detection electrode (3-DCE) for a high and uniform sensitivity to sense micro-G (G=9.8m/s2) level. Based on the analysis in terms of the sensitivity and the Brownian noise BN, we design and fabricate the device with 3-DCE by the multi-metal layer technology for a post-CMOS process. The experimental results show that the obtained BN is 160 nG/√Hz and the sensitivities of X-, Y-, and Z-axis are 162, 210, and 341 fF /G, respectively.