[12a-N106-1~9] 22.1 Joint Session M "Phonon Engineering"

△ [12a-N106-7] Evaluation of Chemical Bonding States in Ru/TaN/Si for Thermal Management of
Next Generation VLSI Interconnection

〇Keita Sahara¹, Ryo Yokogawa^1,2, Tappei Nishihara¹, Naomi Sawamoto^1,2, Tianzhuo Zhan^3,4, Takanobu Watanabe³, Atsusi Ogura^1,2 (1.Meiji Univ., 2.MREL, 3.Waseda Univ., 4.Toyo Univ.)

Keywords:thermal conduction