The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[12a-N305-1~10] 13.7 Compound and power devices, process technology and characterization

Sun. Sep 12, 2021 9:00 AM - 11:45 AM N305 (Oral)

Takahiro Makino(QST)

10:15 AM - 10:30 AM

[12a-N305-6] Reduction of Schottky barrier height of low work function metal/n-type 4H-SiC interface by post metallization annealing

Takuma Doi1,2, Shigehisa Shibayama1, Mitsuo Sakashita1, Mitsuaki Shimizu2, Osamu Nakatsuka1,3 (1.Grad. Sch. of Eng., Nagoya Univ., 2.AIST-NU GaN-OIL, 3.IMaSS, Nagoya Univ.)

Keywords:4H-SiC, Schottky, contact