[12p-N304-1~14] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

△ [12p-N304-10] Direct conductive bonding method for the gold electrode on ultra-thin polymer film

〇Masahito Takakuwa^1,2, Kenjiro Fukuda², Tomoyuki Yokota³, Daishi Inoue², Daisuke Hashizume², Shinjiro Umezu¹, Takao Someya^2,3 (1.Waseda Univ., 2.RIKEN, 3.Univ. of Tokyo)

Keywords:conductive bonding, surface activation, water vapor plasma

The development of next-generation in-vivo IoT devices and on-skin devices is expected by integrating ultra-thin electronics such as µm-thick of sensors and antennas. However, a conductive adhesive is used as the conventional integration method of ultra-thin electronics fabricated on the separated substrate, caused lost flexibility of a bonding area by thickness of themselves. In this research, we report the development of a new mounting technology that directly bonds gold electrodes on a thin film with metal bonds instead of adhesives.