The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[12p-N305-1~14] 13.7 Compound and power devices, process technology and characterization

Sun. Sep 12, 2021 1:30 PM - 5:15 PM N305 (Oral)

Kenji Shiojima(Univ. of Fukui), Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

2:00 PM - 2:15 PM

[12p-N305-3] Low on-resistance p-n junction diode using highly Ge-doped GaN substrate II
~ reduced forward-current-density dependence on anode-electrode diameter ~

Hiroshi Ohta1, Naomi Asai1, Kazuhiro Mochizuki1, Horikiri Fumimasa2, Narita Yoshinobu2, Mishima Tomoyoshi1 (1.Hosei Univ., 2.SCIOCS)

Keywords:p-n junction diode, Ge-doped GaN substrate, Anode electrode diameter dependence

We evaluated the anode electrode diameter dependence of the forward characteristics of a p-n junction diode using a high-concentration Ge-doped GaN substrate. As a result, the decrease in current density due to the increase in diameter was smaller in the p-n diode on the Ge-doped (6-8×1018 cm-3) substrate than in the p-n diode on the normal Si-doped (2×1018 cm-3) substrate. From the above, it was clarified that increasing the concentration of the substrate is also advantageous for increasing the diameter of the p-n diode.