The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[12p-N305-1~14] 13.7 Compound and power devices, process technology and characterization

Sun. Sep 12, 2021 1:30 PM - 5:15 PM N305 (Oral)

Kenji Shiojima(Univ. of Fukui), Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

2:15 PM - 2:30 PM

[12p-N305-4] Breakdown characteristics of p-GaN/AlGaN/GaN diode with controlled charge concentration by changing Mg-doped GaN thickness

〇(M2)Soichiro Kawata1, Yuwei Zhang1, Iwata Naotaka1 (1.Toyota Tech. Inst.)

Keywords:gallium nitride

The p-GaN/AlGaN/GaN heterostructure superjunction can achieve low on-resistance and high breakdown-voltage. For high breakdown-voltage, it is necessary to balance positive and negative charge concentrations. The charge concentrations were controlled by changing the thickness of p-GaN layer. For the more than 50nm thick p-GaN layer, there is no correlation between the drift-region-lengths and the breakdown-voltages. For the less than 40nm thick p-GaN layer, the breakdown-voltages improved as the drift-region-lengths increased. It is because the charge concentrations are balanced by decrease in the acceptors, then the electric field gets uniform.