The 82nd JSAP Autumn Meeting 2021

Presentation information

Oral presentation

22 Joint Session M "Phonon Engineering" » 22.1 Joint Session M "Phonon Engineering"

[13a-N106-1~5] 22.1 Joint Session M "Phonon Engineering"

Mon. Sep 13, 2021 10:30 AM - 11:45 AM N106 (Oral)

Takanobu Watanabe(Waseda Univ.)

11:30 AM - 11:45 AM

[13a-N106-5] Design and Fabrication of Silicon-Based Micro Thermoelectric Coolers

〇(M2)Eldar Sido1, Ryoto Yanagisawa1, Souta Koike1, Patrick Ruther2, Oliver Paul2, Masashi Kurosawa3, Sebastian Volz1,4, Masahiro Nomura1 (1.IIS Univ. of Tokyo, 2.IMTEK Freiburg Univ., 3.Nagoya Univ., 4.LIMMS, CNRS-IIS)

Keywords:Thermoelectric Coolers, Nano-structures, Device Fabrication

With advent in fabrication of nanoscale devices and improvements in the capabilities of semiconductor device fabrications, more and more MEMS devices are being fabricated that test the limits of fabrication procedures. Nevertheless, currently cooling MEMS devices that can perform highly localized small-scale cooling are unavailable bringing fruition to our research. Here we present nano-structured silicon-based suspended uni-leg planar type thermoelectric coolers that have been designed, fabricated and measurement results validated by an IR camera. The fabricated thermoelectric coolers are the world's smallest thermoelectric devices with TE volume of material per unit device of 180 μm3 and 120 μm3 given two distinct geometries.