[13p-N105-1~14] 3.9 Terahertz technologies

[13p-N105-12] Improvement of the thermal sensitivity of MEMS thermal sensors with mesh nanostructures

〇Ryoko Yamamoto¹, Ryota Seki¹, Isao Morohashi², Naomi Nagai³, Kazuhiko Hirakawa^3,4, Akira Kojima¹, Nobuyoshi Koshida¹, Ya Zhang¹ (1.TUAT, 2.NICT, 3.IIS TU, 4.INQIE TU)

Keywords:MEMS bolometer, phononic structure, thermal conductance

We aim to improve the sensitivity of the MEMS bolometer by introducing a porous mesh phononic (PnC) structure into the beam of MEMS resonator. The mesh PnC structure could significantly reduce the thermal conductance of the MEMS beam by over 90%, thus is very promising for realizing high sensitivity MEMS thermal sensors.