Jian Cao

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Speaker, Author, Co-Author

Thu. Mar 18, 2021 1:30 PM - 5:15 PM Z24 (Z24)

Oral presentation
| 13 Semiconductors
| 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[18p-Z24-1~14] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

4:45 PM - 5:00 PM

[18p-Z24-13] Study on the effects of surface treatment on wafer direct bonding by utilizing chemical derivatization XPS

〇Jian Cao¹, Yukako Ikegami¹, Takashi Ito¹, Takashi Togasaki¹, Hidehiko Yabuhara¹ (1.Toshiba Corp.)