Toshihiro Takeshita

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Speaker, Author, Co-Author

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Symposium (Oral)
| Symposium
| Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

10:45 AM - 11:00 AM

[17a-Z02-5] Development of Sealing method for ultra-thin MEMS device using lamination technology

〇Toshihiro Takeshita¹, Takahiro Yamashita¹, Yusuke Takei¹, Daniel Zymelka¹, Takeshi Kobayashi¹ (1.AIST)