The 68th JSAP Spring Meeting 2021

Presentation information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

9:00 AM - 9:15 AM

[17a-Z02-1] Introduction of Symposium on ‘Toward Construction of “Module Science”’

Atsushi Masuda1 (1.Niigata Univ.)

Keywords:semiconductor devices, solar cells, laser diodes

Encapsulation structures, encapsulation materials, and encapsulation methods of various semiconductor devices including solar cells will be introduced in this symposium. Common and different aspects of degradation factors and degradation phenomena will be also discussed. Common issues in various semiconductor devices will be derived. It is expected that this symposium is the first step of construction of 'Module Science'.