The 68th JSAP Spring Meeting 2021

Presentation information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

9:15 AM - 9:45 AM

[17a-Z02-2] Design and Evaluation of Gas Barrier Materials

Kazukiyo Nagai1 (1.Meiji Univ.)

Keywords:gas barrier, encapsulation, water vapor transmission rate

Plastic films and organic adhesives have been used in various electronic devices. In most cases, because electronic components are sensitively degraded by water and oxygen molecules, these materials are required to have oxygen and water vapor barrier properties to improve the lifetime of the devices. This lecture mainly presents design and evaluation of gas barrier materials for electronic devices.