The 68th JSAP Spring Meeting 2021

Presentation information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

9:45 AM - 10:15 AM

[17a-Z02-3] Packaging Technology of Semiconductor Device

Ken Ukawa1 (1.Sumitomo Bakelite)

Keywords:semiconductor device, packaging technology

住友ベークライトのコア技術である封止技術について、各種のパッケージに適した技術トレンドを紹介する。