The 68th JSAP Spring Meeting 2021

Session information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

△:Presentation by Applicant for JSAP Young Scientists Presentation Award
▲:English Presentation
▼:Both of Above
No Mark:None of Above

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