Symposium (Oral)
Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices
Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)
Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)
△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above
9:00 AM - 9:15 AM
〇Atsushi Masuda1 (1.Niigata Univ.)
Schedule
Like
)
9:15 AM - 9:45 AM
〇Kazukiyo Nagai1 (1.Meiji Univ.)
Schedule
Like
)
9:45 AM - 10:15 AM
〇Ken Ukawa1 (1.Sumitomo Bakelite)
Schedule
Like
)
10:15 AM - 10:45 AM
〇Yuji Yamagata1, Yohei Kasai1, Yoshikazu Kaifuchi2, Toshiyuki Kawakami1 (1.Fujikura, 2.Optoenergy)
Schedule
Like
)
10:45 AM - 11:00 AM
〇Toshihiro Takeshita1, Takahiro Yamashita1, Yusuke Takei1, Daniel Zymelka1, Takeshi Kobayashi1 (1.AIST)
Schedule
Like
)
11:15 AM - 11:45 AM
〇Taeko Semba1 (1.Niigata Univ.)
Schedule
Like
)
11:45 AM - 12:15 PM
〇Kouichirou Niira1, Norikazu Itou1, Tomonari Sakamoto1, Shirou Inoue1 (1.Kyocera Corp.)
Schedule
Like
)
12:15 PM - 12:30 PM
〇Kodai Nakamura1, Thi Cam Tu Huynh1, Keisuke Ohdaira1 (1.JAIST)
Schedule
Like
)
Password Authentication
The password will be sent by email on February 26 to the early bird registrants.
To late registrants, The password will be sent in a registration confirmation email.
Please log in with your participant account.
» Participant Log In