The 68th JSAP Spring Meeting 2021

Presentation information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

11:15 AM - 11:45 AM

[17a-Z02-6] The metallization corrosion mechanism caused by acetic acid in c-Si PV modules

Taeko Semba1 (1.Niigata Univ.)

Keywords:glass and ceramics, metal and alloy, chemical durability