[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-4] Packaging technology for high-power semiconductor laser light sources

〇Yuji Yamagata¹, Yohei Kasai¹, Yoshikazu Kaifuchi², Toshiyuki Kawakami¹ (1.Fujikura, 2.Optoenergy)

Keywords:high power laser, semiconductor laser, package

A high-power semiconductor laser diode with lasing wavelength in the 900 nm band is capable of high-power operation of 20 W per emitter. A fiber coupled module that combines a large number of laser beams by beam shaping technology is used as an excitation light source in fiber lasers. Long-term stability is required for each components of LD module under high light density and high temperature conditions.In this study, packaging technology for realizing high power LD module is discussed.