Development of Sealing method for ultra-thin MEMS device using lamination technology

Toshihiro Takeshita; Takahiro Yamashita; Yusuke Takei; Daniel Zymelka; Takeshi Kobayashi

Presentation information

Symposium (Oral)

Symposium » Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

[17a-Z02-1~8] Start up of "Module Science": Comparison of Packaging Technologies of Various Semiconductor Devices

Wed. Mar 17, 2021 9:00 AM - 12:30 PM Z02 (Z02)

Yasushi Sobajima(Gifu Univ.), Atsushi Masuda(Niigata Univ.)

10:45 AM - 11:00 AM

[17a-Z02-5] Development of Sealing method for ultra-thin MEMS device using lamination technology

〇Toshihiro Takeshita¹, Takahiro Yamashita¹, Yusuke Takei¹, Daniel Zymelka¹, Takeshi Kobayashi¹ (1.AIST)

Keywords:FHE, ultra-thin MEMS, Sealing

In this research, we have developed a novel sealing method using lamination technology for the purpose of batch and simple sealing of ultra-thin MEMS chip for FHE (Flexible Hybrid Electronics) devices. We have succeeded in sealing and driving an ultra-thin piezoelectric device (7.26 μm in thickness) using the developed sealing method.