[17p-Z26-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

▼ [17p-Z26-15] 3-Color Micro-LED Integration for Flexible Display Based on Die-First Fan-Out Wafer-Level Packaging Technology

〇(M2)Zhe Wang¹, Yuki Susumago¹, Tomo Odashima¹, Noriyuki Takahashi², Hisashi Kino³, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1.Tohoku Univ. Grad. Sch. of Eng., 2.Tohoku Univ. Grad. Sch. of Biomedical Eng., 3.Tohoku Univ. FRIS)

Keywords:flexible display, micro-LED, FOWLP

Flexible displays have various advantages such as thin structure, light weight, and excellent pliability. Typical flexible display fabrication is divided into two categories: roll-to-roll and transfer processes. In the former roll-to-roll process, optical devices and interconnections are deposited or printed directly on plastic substrates. However, the plastic substrates are plagued by the difficulty of handling during the fabrication process. Recently, most flexible displays are fabricated with organic light emitting diode (OLED) devices. On the other hand, inorganic micro-LED devices shows higher efficiency/brightness and longer lifetime, compared to OLED. However, micro-LED displays are facing two challenging problems. The first one is the transfer of the micro-LEDs, and the second one is the packaging of the tiny micro-LED dies. In this study, we employ a fan-out wafer-level packaging (FOWLP) methodology [1] and demonstrate the integration of 3-color micro-LED dies embedded in an elastomer PDMS as a substrate to fabricate a micro-LED flexible display.