The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

12 Organic Molecules and Bioelectronics » 12.7 Biomedical Engineering and Biochips

[18a-Z22-1~11] 12.7 Biomedical Engineering and Biochips

Thu. Mar 18, 2021 9:00 AM - 12:00 PM Z22 (Z22)

Toshihiko Noda(Toyohashi Univ. of Tech.), Hiroto Sekiguchi(Toyohashi Univ. of Tech.)

10:00 AM - 10:15 AM

[18a-Z22-5] Fabrication and Characterization of Sterilization Hydrogel Patch with Embedded UV-LED

Noriyuki Takahashi1, Yuki Susumago2, Zhe Wang2, Tomo Odashima2, Hisashi Kino3, Tetsu Tanaka1,2, Takafumi Fukushima1,2 (1.Grad. Sch. of Biomed. Eng., Tohoku Univ., 2.Grad. Sch. of Eng., Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:Hydrogel

In recent years, research on flexible hybrid electronics (FHE), which combines the performance of inorganic single crystal semiconductors with the flexibility of organic substrates, has attracted attention. So far, we have proposed a new structure FHE that utilizes a fan-out type wafer level packaging technology in which an LSI chip is embedded in a hydrogel substrate. In this presentation, we will describe the production and evaluation of sterilization hydrogel patch with embedded UV-LED by applying the technology.