The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

12 Organic Molecules and Bioelectronics » 12.1 Fabrications and Structure Controls

[20p-C106-1~13] 12.1 Fabrications and Structure Controls

Tue. Sep 20, 2022 1:30 PM - 5:30 PM C106 (C106)

Yasuhiro Miura(Hamamatsu Univ. School of Medicine), Shunsuke Yamamoto(Tohoku Univ.), Atsushi Kubono(Shizuoka Univ.)

4:30 PM - 4:45 PM

[20p-C106-10] Fabrication of Wound Healing FHE Using Hydrogel for Photobiomodulation

〇(M1)Tadaaki Hoshi1, Yuki Susumago1, Chang Liu1, Atsushi Shinoda2, Hisashi Kino3, Tetsu Tanaka1,3, Takafumi Fukushima1,3 (1.Graduate School of Engineering, Tohoku Univ., 2.School of Engineering, Tohoku Univ., 3.Graduate School of Biomedical Engineering, Tohoku Univ.)

Keywords:Photobiomodulation, Hydrogel

We propose wound healing patches using hydrogel as a substrate as an application of new structure Flexible Hybrid Electronics (FHE) based on Fan-Out Wafer-Level Packaging (FOWLP) in which the chiplets are embedded in an organic substrate. In this study, we report on the fabrication of FHE patches for moist photobiomodulation of chronic wounds such as bedsores using NIR-µLED chips with a light source in the near-infrared region and the photobiomodulation effect.