The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[22a-B204-1~11] 13.7 Compound and power devices, process technology and characterization

Thu. Sep 22, 2022 9:00 AM - 12:00 PM B204 (B204)

Mitsuru Sometani(AIST), Takuji Hosoi(Kwansei Gakuin Univ.)

11:15 AM - 11:30 AM

[22a-B204-9] Thermal stress effects on local electronic properties on N-type 4H-SiC crystals
in contact with multilayer electrode film by micro-Raman spectroscopy at
high temperatures

Seiya Kondo1, Suda Jun1 (1.Chukyo Univ.)

Keywords:Widegap semiconductor, Micro-Raman spectroscopy, Electronic properties

車載用パワーデバイスにおいて4H-SiCは200℃以上の高温動作させる場合があり,電極界面の熱応力変化や電子物性を知る必要がある. 本研究では,高温領域の多層電極(Cr/Ti/Au)付n形4H-SiCの電極界面におけるラマンスペクトルより,熱応力と高温電子物性を求めた.電極近傍と遠方のn形4H-SiC結晶の電子密度を比較すると,電極近傍の電子密度は下がっていくことがわかった.