Nanosecond laser processing of tungsten-rhenium alloys without cracking

Presentation information

Oral presentation

3 Optics and Photonics » 3.6 Laser processing (formerly 3.7)

Thu. Sep 22, 2022 1:30 PM - 6:15 PM C301 (C301)

Yoichiroh Hosokawa(NAIST), Yasutaka Hanada(Hirosaki Univ.), Tsuyoshi Yoshida(National Defense Academy of Japan)

3:00 PM - 3:15 PM

〇Haotian Yang¹, Hiyori Uehara^1,2, Hiroyuki Noto^1,2, Chihiro Suzuki^1,2, Ryo Yasuhara^1,2 (1.SOKENDAI, 2.NIFS)

Keywords:laser ablation, tungsten-rhenium alloy, surface modification