The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[23a-B204-1~11] 13.7 Compound and power devices, process technology and characterization

Fri. Sep 23, 2022 9:00 AM - 12:00 PM B204 (B204)

Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

9:15 AM - 9:30 AM

[23a-B204-2] Fabrication of a 150 nm Class Y-Shaped Gate AlGaN/GaN HEMT Using i-Line Stepper

Yuji Ando1,2, Hidemasa Takahashi1, Ryutaro Makisako1, Akio Wakejima3, Jun Suda1,2 (1.Nagoya Univ., 2.Nagoya Univ. IMaSS, 3.Nagoya Inst. Tech.)

Keywords:GaN, HEMT

A high throughput gate formation process combining i-line stepper and thermal reflow techniques was developed and applied to fabricate GaN-HEMTs. Since previously fabricated GaN-HEMTs involved an issue of large parasitic capacitances, we have newly developed a Y-shaped gate process based on these techniques to reduce the parasitic capacitances. Fabricated GaN-HEMTs showed improved ft and fmax indicating the reduced parasitics.