The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

1 Interdisciplinary Physics and Related Areas of Science and Technology » 1.5 Instrumentation, measurement and Metrology

[24p-D113-1~17] 1.5 Instrumentation, measurement and Metrology

Thu. Mar 24, 2022 1:00 PM - 6:00 PM D113 (D113)

Nao Terasaki(AIST)

5:30 PM - 6:00 PM

[24p-D113-17] [INVITED] Development of a method for estimating the residual strength of degraded adhesives

〇Kazumasa Shimamoto1, Haruhisa Akiyama1 (1.AIST)

Keywords:Adhesive bonding, Degradation, Residual strength

Adhesively bonded joints have been attracting attention as a method of joining structural components such as automobiles. When adhesive bonding is used to join structural components, it is important to ensure the long-term reliability of the bonded joints, as they may degrade over time and lose their mechanical strength. In this study, a method to quantitatively evaluate the residual strength of degraded cured adhesives was investigated using spectroscopic analysis.