The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[25a-E103-1~9] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Fri. Mar 25, 2022 9:30 AM - 12:00 PM E103 (E103)

Masato Sone(Tokyo Tech), Daisuke Yamane(Ritsumeikan Univ.)

11:45 AM - 12:00 PM

[25a-E103-9] Evaluation of Transferred FDSOI Transistors and Logic Circuits for Flexible CMOS Image Sensors

〇Masahide Goto1, Shigeyuki Imura1 (1.NHK STRL)

Keywords:image sensor, transfer, flexible

We have studied flexible CMOS image sensors to realize new image sensors with both high performance and flexibility. CMOS circuits and photoconductive films including crystalline selenium developed on FDSOI substrates were transferred to flexible plastic substrates. We confirmed the first operation of the transferred FDSOI transistors and logic circuits, demonstrating the feasibility of next-generation flexible CMOS devices.