The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[25p-E307-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Fri. Mar 25, 2022 1:30 PM - 5:30 PM E307 (E307)

Takeshi Momose(Univ. of Tokyo), Osamu Sugiura(千葉工大)

5:00 PM - 5:15 PM

[25p-E307-14] Development of FHE Devices for Photobiomodulation Using FOWLP

〇Tadaaki Hoshi1, Tomo Odashima2, Yuki Susumago2, Shunsuke Arayama1, Hisashi Kino3, Tetsu Tanaka2,3, Takafumi Fukushima2,3 (1.School of Engineering, Tohoku Univ., 2.Graduate School of Engineering, Tohoku Univ., 3.Graduate School of Biomedical Engineering, Tohoku Univ.)

Keywords:dimethylpolysiloxane, hydrogel, flexible hybrid electronics

Research on flexible hybrid electronics (FHE), which contributes to the creation of high-performance flexible devices by integrating a hard single-crystal semiconductor chip with a flexible organic substrate, has attracted much attention.
This presentation picks up a novel FHE structure in which a small chip is integrated into a substrate using FOWLP.
In this study, we fabricated a prototype device for photo-biomodulation by using a small near-infrared LED chip and adopting FOWLP suitable for each method, which we call Chip-last method for hydrogel substrate and Chip-first method for PDMS substrate with three-dimensional structure.