Symposium (Oral)
Symposium » 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics Packaging (JIEP)
Thu. Mar 16, 2023 9:00 AM - 12:10 PM E302 (Building No. 12)
Noriaki Matsunaga(Applied Materials Japan), Yasumitsu Orii(Rapidus), Fumihiro Inoue(YNU)
△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above
9:00 AM - 9:30 AM
〇Kazuyoshi Ueno1 (1.Shibaura Inst. Tech.)
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9:30 AM - 10:00 AM
〇Takafumi Fukushima1 (1.Tohoku Univ.)
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10:00 AM - 10:30 AM
〇Shinichi Ouchi1 (1.AIST)
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10:40 AM - 11:10 AM
〇Masahisa Fujino1 (1.AIST)
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11:10 AM - 11:40 AM
〇Yasuhiro Morikawa1 (1.ULVAC, ATI)
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11:40 AM - 12:10 PM
〇Ryuichi Matsuki1, Shinji Nakazawa1, Kiyoshi Oi1, Noritaka Katagiri1, Yasushi Araki1 (1.SHINKO ELECTRIC INDUSTRIES)
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