The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

6 Thin Films and Surfaces » 6.2 Carbon-based thin films

[15p-A408-1~14] 6.2 Carbon-based thin films

Wed. Mar 15, 2023 1:00 PM - 4:45 PM A408 (Building No. 6)

Kazuhiro Kanda(Univ. of Hyogo), Toru Harigai(Toyohashi Univ. of Tech.)

1:15 PM - 1:30 PM

[15p-A408-2] Chemical bonding evaluation of DLC films using HiPIMS and high frequency HiPIMS methods

〇(DC)Hiroyuki Fukue1, Tatsuyuki Nakatani1, Tadayuki Okano2, Masahide Kuroiwa2, Shinsuke Kunitsugu3, Susumu Takabayashi4, Hiroki Oota5, Ken Yonezawa5,1 (1.Okayama Univ. of Sci., 2.Tokyo Electronics Co., Ltd., 3.Ind. Technol. Cent. Okayama Pref., 4.National Inst. Technol., Ariake College, 5.Kenix Corporation)

Keywords:diamond-like carbon, X-ray photoelectron spectroscopy

We have been developing a new HiPIMS (High-Power Impulse Magnetron Sputtering) method, HF (High Frequency)-HiPIMS power supply, for further functionalization of thin films. In this study, we report on the chemical bonding of DLC (Diamond-Like Carbon) films using conventional HiPIMS and HF-HiPIMS methods. DLC films deposited by HF-HiPIMS method increased diamond bonding compared to those deposited by conventional HiPIMS method. Therefore, the effectiveness of the HF-HiPIMS method was confirmed.

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