[15p-A502-1~18] 3.14 Silicon photonics and integrated photonics (formerly 3.15)

[15p-A502-13] Investigation of hybrid integration of multifunctional devices by chip bonding

〇Takumi Takahashi¹ (1.Waseda Univ.)

Keywords:integration technology, chip bonding

Silicon photonics has already been put to practical use as an ultra-high-speed optical transceiver for data centers. High-efficiency hybrid integration of multiple heterogeneous optical devices will be important in the future. In that respect, we are devising and studying a chip bonding technology by 3D position control that can sequentially integrate arbitrary optical devices at arbitrary positions of silicon waveguide platforms on SOI (silicon insulator) substrates. Here, we report on the results of a basic study of this chip bonding technology.