Deep etching of SOI substrate and chip bonding

Presentation information

Oral presentation

3 Optics and Photonics » 3.14 Silicon photonics and integrated photonics (formerly 3.15)

Wed. Mar 15, 2023 1:10 PM - 6:00 PM A502 (Building No. 6)

Shota Kita(NTT), Tomohiro Kita(Waseda Univ.), Taichiro Fukui(Univ. of Tokyo)

4:45 PM - 5:00 PM

〇Dingyue Qu¹, Takumi Takahashi¹, Yuichi Matsushima¹, Hiroshi Ishikawa¹, Katsuyuki Utaka¹ (1.Waseda Univ.)

Keywords:chip bonding, silicon on insulator, etch