12:15 PM - 12:30 PM
[16a-D519-13] Reaction mechanism of atomic layer etching process of SiNx film using O2-GCIB and acetylacetone
Keywords:Gas cluster ion beam, Atomic layer etching, Silicon nitride
In this study, we demonstrate the proof-of-principle of atomic layer etching of SiNx film using O2-GCIB and acetylacetone (acac). Also, we investigate mechanism of the reaction layer formation by acetylacetone and the reaction layer removal by O2-GCIB irradiation. The surface conditions at each step were evaluated by XPS. The results show that the ALE proceed through the following process: oxidation of the SiNx film surface by O2-GCIB irradiation, adsorption of acac vapor on the oxidized layer, and removal of the reaction layer by O2-GCIB irradiation. The detail of this reaction process will be discussed quantitatively in this presentation.