[16a-PA06-1~13] 3.7 Optical measurement, instrumentation, and sensor (formerly 3.8)

[16a-PA06-10] Development of a laser-based inspection method for micro semiconductor chips

〇Reo Terauchi¹, Katsuhiro Mikami¹, Tetsuya Matsuyama¹, Kenichi Ikeda², Yusuke Nakaminami², Masanori Otake² (1.Kindai Univ., 2.Opto Systems Co., LTD)

Keywords:semiconductor, vibration spectrum, laser doppler vibrometer

In recent years, traceability of semiconductor chips used in LiDAR and other devices in automated driving systems has been required for quality control. However, current visual inspections cannot be fully automated, and there are issues that result in defective products that slip through the inspection process, which requires a lot of time and effort. We propose laser-induced vibration inspection using a laser Doppler vibrometer as an automated rupture inspection method for minute semiconductor chips. The chip rupture can be inspected by vibrating the chip with laser irradiation and measuring and analyzing the results using a laser Doppler vibrometer. The purpose of this study is to clarify the effect of laser excitation on the vibration spectrum of normal and broken semiconductor chips and to obtain an index for the proposed inspection.