The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

11 Superconductivity » 11.5 Junction and circuit fabrication process, digital applications

[16p-D215-1~16] 11.5 Junction and circuit fabrication process, digital applications

Thu. Mar 16, 2023 1:30 PM - 6:00 PM D215 (Building No. 11)

Yoshinao Mizugaki(UEC), Yuki Yamanashi(Yokohama Natl. Univ.), Naoki Takeuchi(AIST)

2:45 PM - 3:00 PM

[16p-D215-6] Investigation of fabrication methods of large-area superconducting quantum circuits using an ArF immersion lithography system

Satoru Odate1, Saito Naooki1, Suzuki Kosuke1, Aoyama Hajime1, Tsukamoto Hiroyuki1, Kusuyama Koichi2, Nakamura Yasunobu2,3 (1.Nikon Corp, 2.Riken, 3.U. of Tokyo)

Keywords:Superconducting circuits

The race to develop methods for fabricating large-scale superconducting quantum circuits has begun all over the world, recently. We have started to develop a method for fabricating large-scale quantum circuits on 12-inch silicon wafers using an ArF immersion lithography system within Japanese National R&D fund program. We will explain the progress of this development.