The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[16p-PA03-1~6] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA03 (Poster)

1:30 PM - 3:30 PM

[16p-PA03-6] MEMS Rogowski Coil Current Sensor with Radially Formed Spiral Return Coil

Yoshiyuki Watanabe1, Mutsuto Kato1, Toru Yahagi1, Hiroki Murayama1, Naoya Yamada1, Kazuki Yoshida1, Kenichi Yoshida2, Kenichi Maehara2, Makiko Noma2, kazuyuki Sashida2, Shoma Hoki2, Katsuya Ikeda2, Toshiyuki Takemori2 (1.Yamagata Res. Inst. Tech., 2.Shindengen)

Keywords:MEMS, Rogowski coil, current sensor

We have fabricated a MEMS Rogowski coil current sensor with a radially formed TSV structure. A coil that rotates clockwise within the cross section of the substrate is formed, and a return coil that rotates counterclockwise from the terminal end is formed to simultaneously perform current detection and external magnetic field cancellation. In both evaluations with a constant di/dt of 10A/μs and varying the peak current up to 200A, and evaluations with a constant peak current of 200A and varying di/dt up to 50A/μs, it is proportional to the applied current. It was confirmed that the output was obtained.