The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[16p-PA04-1~24] 13.7 Compound and power devices, process technology and characterization

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA04 (Poster)

1:30 PM - 3:30 PM

[16p-PA04-1] Two-dimensional characterization of Au/Ni/p+-SiC Schottky contacts by scanning internal photoemission microscopy

Hiroki Imabayashi1, Hitose Sawazaki1, Haruto Yoshimura1, Natsuki Ito1, Masashi Kato2, Kenji Shiojima1 (1.Univ. of Fukui, 2.Nagoya Inst. Tech.)

Keywords:Scanning Internal Photoemission Spectroscopy, p-SiC, Two-dimensional Characterization

We have originally developed Scanning internal photoemission microscopy (SIPM) for two-dimensional characterization of the electrical properties of metal/semiconductor interfaces. We have evaluated the uniformity of the Schottky barrier height of n-SiC, n-GaN, n-α-Ga2O3 Schottky contacts so far. In this study, we evaluated the uniformity of the p+-SiC layers, which has been rarely reported.