The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[16p-PA04-1~24] 13.7 Compound and power devices, process technology and characterization

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA04 (Poster)

1:30 PM - 3:30 PM

[16p-PA04-20] Analysis of Lateral Superjunction Silicon Power Device with Multiple Layers by TCAD Simulation

〇(M2)Peilin Ji1, Munetoshi Fukui1, Takuya Saraya1, Masaharu Kobayashi1, Toshiro Hiramoto1 (1.The Univ. of Tokyo)

Keywords:superjunction, power device

One of the advantages of a lateral power device over a vertical one is that it is easier to integrate with other transistors. The lateral superjunction (SJ) device is promising as a future integrated power device with high breakdown voltage (VBD) and low specific on-resistance (RON, sp). However, one of the demerits of SJ devices is that VBD is very sensitive to the balance of p/n concentrations (NA and ND). In this work, the device characteristics of SJ devices with two layers and multiple layers were simulated and analyzed.