The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[16p-PA04-1~24] 13.7 Compound and power devices, process technology and characterization

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA04 (Poster)

1:30 PM - 3:30 PM

[16p-PA04-22] Comparison of body diode recovery characteristics of 650V power devices

Yoshiyuki Hattori1, Tetsu Kachi2 (1.Daido Univ., 2.Nagoya Univ. IMaSS)

Keywords:power semiconducter device, body diode

As power devices with breakdown voltage of 650 V, Si-RC-IGBT, Si-Super Junction MOSFET, SiC- MOSFET, and Cascode GaN-FET are commercially available. In this study, we compared the recovery characteristics of the body diodes of the above four devices, which consist of one chip, have the same rating (breakdown voltage of 650 V, drain current of 40A) and the same package (TO-247).