The 70th JSAP Spring Meeting 2023

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[16p-PA04-1~24] 13.7 Compound and power devices, process technology and characterization

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA04 (Poster)

1:30 PM - 3:30 PM

[16p-PA04-5] Simulation of critical angles for channeled ion implantation into 4H-SiC

Tomoaki Nishimura1 (1.Hosei Univ.)

Keywords:SiC, channeling implantation, critical angle

The critical angle is an indicator of whether channeled ion implantation is avairable. There is a simple formula that gives the critical angle near the surface, but it is difficult to predict the critical angle for deeper layers. The author has developed a program for calculating incident ion trajectories in crystals and implantation (scatGUI), which can reproduce the critical angles at the surface and in deep layers.