10:30 〜 10:45
▲ [17a-B414-7] EOT scaling of top-gate MoS2 FET below 1 nm
キーワード:top gate 2D FET, EOT scaling, high-k oxides
Thermal evaporation of Er2O3 has shown great potential as an alternative to atomic layer deposition for the scaling of equivalent oxide thickness (EOT) as a top-gate insulator in 2D transistors. However, the reduction of oxide thickness can lead to the loss of dielectric properties and unexpected changes at the interface, which requires further investigation of devices with thinner insulators. In this work, we demonstrate the successful integration of 3.5 nm of Er2O3 as the top gate of a MoS2 FET, resulting in an on/off switch within 1 V and an EOT of 0.94 nm. Low-temperature photoluminescence and Raman characterization reveal minimal defects introduced by the Er2O3 deposition, indicating the potential for further scaling by applying this novel deposition method to 2D FETs.