The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

22 Joint Session M » 22.1 Joint Session M "Phonon Engineering"

[17p-D511-1~15] 22.1 Joint Session M "Phonon Engineering"

Fri. Mar 17, 2023 1:15 PM - 5:30 PM D511 (Building No. 11)

Yoshiaki Nakamura(Osaka Univ.), Masahiro Nomura(Univ. of Tokyo), Daiki Hatanaka(NTT)

3:00 PM - 3:15 PM

[17p-D511-7] In-plane Thermal Diffusivity Measurement of a Suspended SiNx
Membrane by Temperature Wave Analysis

〇(D)Junko Morikawa1, Felix Juang2, Meguya Ryu3, Xuan Thang Vu2, Sven Ingebrandt2 (1.Tokyo Tech, 2.RWTH Aachen Univ., 3.AIST)

Keywords:thermal diffusivity, THIN membrane

The thermal properties of thin films are crucial for their applications in heat-intensive environments such as thermoelectrics and power electronics. In this work, we compared different configurations for a previously developed thermal measurement device based on a 50 nm or 150 nm thin SiNx membrane.
The device allows measurement of thermal parameters for different heater-sensor distances utilizing a temperature wave analysis method. Different configurations for the sensor position (linear or spiral shaped array) and the substrate (membrane thickness of 50 nm or 150 nm) are compared.