The 70th JSAP Spring Meeting 2023

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Symposium (Oral)

Symposium » Trends and Prospects of MEMS and Microfabrication Technologies Contributing to the With-Covid-19 Era

[17p-E502-1~9] Trends and Prospects of MEMS and Microfabrication Technologies Contributing to the With-Covid-19 Era

Fri. Mar 17, 2023 1:30 PM - 5:00 PM E502 (Building No. 12)

Masahide Goto(NHK), Toshihiro Takeshita(産総研), Toshishige Shimamura(NTT)

2:05 PM - 2:35 PM

[17p-E502-3] Wearable MEMS integration technology for VR/AR and Metaverse

〇Seiichi Takamatsu1 (1.Univ. of Tokyo)

Keywords:MEMS, Virtual Reality, Packaging Technology

Recently, the development of wearable MEMS packaging technology to digitalize people's movement has become important because people's work on VR/AR and metaverse has been growing due to the progress of remote work and DX. In this talk, we will introduce a stress relocation package structure that can solder hard sensors and vibration motors on soft fabrics with high reliability to realize wearables for the metaverse. A VR system using this structure and e-textile will also be presented.