The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

6 Thin Films and Surfaces » 6.5 Surface Physics, Vacuum

[18p-D519-1~15] 6.5 Surface Physics, Vacuum

Sat. Mar 18, 2023 1:00 PM - 5:15 PM D519 (Building No. 11)

Naoka Nagamura(NIMS), Kei Mitsuhara(KOBELCO RESEARCH INSTITUTE, INC.)

1:45 PM - 2:00 PM

[18p-D519-4] A Liquid-Solid Nonequilibrium Heterointerface for Programmable Patterning of 1D-Nanowire-Based Soft Electronics

Lingying Li1, Wanli Li2, Tenjimbayashi Mizuki1, Masayuki Kanehara3, Hiroyo Segawa1, Chisato Niikura1, Tomonobu Nakayama1, Takeo Minari1 (1.NIMS, 2.Jiangnan Univ., 3.C-INK)

Keywords:interface, directed self-assembly, soft electronics

Soft electronics, which can be adhered to arbitrary surfaces to carry out high perception-driven tasks or be deformable standalone devices with portability, lightweight, and applicability, are expected to offer unparalleled comfort in our daily life. The device properties are highly attributed to the reasonable pattering of functional nanomaterials, especially 1D nanowires. Although diversified patterning technologies have been developed, patterning composed materials with satisfactory functionality and deformability in a sustainable and scalable manner remains an open issue.
Here, a nonequilibrium heterointerface is demonstrated by programmable engineering of solid-liquid interfacial energy for liquid-mediated patterning of silver nanowires (AgNWs) into large-area flexible circuits. In detail, we managed the properties of the liquid phase (AgNW aqueous solution), including surface tension and capillary force, as well as the solid phase (polymer substrate), including surface free energy and surface polarity. After overlaying the AgNW solution onto the modified substrate via simple slit coating, a periodic solid-liquid interfacial flow is generated to align the dispersed AgNWs onto the designated regions of the substrates during room-temperature drying. By utilizing the proposed strategy, AgNW circuits with different structures can be patterned with high accuracy and homogeneity. Moreover, a flexible transparent heater with adjustable localized heat sources and extensive applicable temperature range has been fabricated successfully. These results present routes to cost-effective, high-performance, and multi-functional platforms for soft electronics manufacturing.