Autumn Meeting of the Japan Society of Powder and Powder Metallurgy, 2019

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Special Issue: High-Performance Electronic Components and Materials for Smart Society

Special Issue: High-Performance Electronic Components and Materials for Smart Society

Wed. Oct 23, 2019 10:30 AM - 12:10 PM Room II (1F, Symposion Hall)

Chairperson:Katsumi KIKUCHI(NEC Corporation)

11:30 AM - 12:10 PM

[2-27] Memorial Lecture of JSPM Award
Development and practical application of low-temperature sintering nano Ag for semiconductor IC bonding

*Koji SASAKI1, Noritsuka MIZUMURA1 (1. NAMICS CORPORATION)

Keywords:Nano silver, Sintering, Die attach material, Bare Cu substrate

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