<strong>Invited Talk : Development of AlN whiscker fillers for high-thermal conductivity of resin</strong>

Presentation information

Special Issue: High-Performance Electronic Components and Materials for Smart Society

Wed. Oct 23, 2019 1:10 PM - 2:10 PM Room II (1F, Symposion Hall)

Chairperson:Kenji KAWAGUCHI(National Institute of Advanced Industrial Science and Technology（AIST）)

1:10 PM - 1:30 PM

*TORU UJIHARA¹ (1. Nagoya University)

Keywords:resin, high thermal conductivity, AlN, filler

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