Special Interest Session » Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Special Interest Session: Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Wed. Nov 20, 2024 3:15 PM - 4:45 PM Room II (2F, Room 203+204)

Chairperson:Takumi Nishikubo(Kanagawa Institute of Industrial Science and Technology)

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3:15 PM - 3:35 PM

[2-41] Invited Talk : Mechanical stress control through the use of negative thermal expansion materials in Integrated Circuits (ICs) 《 Physical Property 》

*Hisashi Kino¹ (1. Kyushu University)

3:35 PM - 3:50 PM

[2-42A] Study on Warpage Suppression in FDM 3D Printing of Negative Thermal Expansion Material Filler 《 Physical Property 》

Masaya Sakagami¹, Saito Ishiue¹, Maiki Kawaguchi¹, *Akihiro Takezawa¹ (1. Waseda University)

3:50 PM - 4:10 PM

[2-43] Invited Talk : Negative Thermal Expansion and Large Magnetic-Field-Induced Volume Change in Sintered Chromium Tellurides 《 Physical Property 》

*Yoshihiko OKAMOTO¹ (1. The University of Tokyo)

4:10 PM - 4:30 PM

[2-44] Invited Talk : Interplanar magnetic orders and symmetry-tuned zero thermal expansion in kagomé metal (Zr,Ta)Fe₂ 《 Synthesis Process, Physical Property 》

*Yili Cao¹ (1. Institute of Solid State Chemistry, University of Science & Technology Beijing)

4:30 PM - 4:45 PM

[2-45A] Negative thermal expansion accompanied by an electronic phase transition of double perovskite Pb₂MgReO₆ 《 Synthesis Process, Physical Property 》

*Koki SHIBUYA¹, Daigorou HIRAI¹, Koshi TAKENAKA¹ (1. Nagoya University）（※This presenter is a candidate for the Student Award for Outstanding Presentation.　)

Session information

Special Interest Session: Suppression of Thermal Expansion by Negative Thermal Expansion Materials

[2-41] Invited Talk : Mechanical stress control through the use of negative thermal expansion materials in Integrated Circuits (ICs) 《 Physical Property 》

[2-42A] Study on Warpage Suppression in FDM 3D Printing of Negative Thermal Expansion Material Filler 《 Physical Property 》

[2-43] Invited Talk : Negative Thermal Expansion and Large Magnetic-Field-Induced Volume Change in Sintered Chromium Tellurides 《 Physical Property 》

[2-44] Invited Talk : Interplanar magnetic orders and symmetry-tuned zero thermal expansion in kagomé metal (Zr,Ta)Fe₂ 《 Synthesis Process, Physical Property 》

[2-45A] Negative thermal expansion accompanied by an electronic phase transition of double perovskite Pb₂MgReO₆ 《 Synthesis Process, Physical Property 》

Authentication

Session information

Special Interest Session: Suppression of Thermal Expansion by Negative Thermal Expansion Materials

[2-41] Invited Talk : Mechanical stress control through the use of negative thermal expansion materials in Integrated Circuits (ICs) 《 Physical Property 》

[2-42A] Study on Warpage Suppression in FDM 3D Printing of Negative Thermal Expansion Material Filler 《 Physical Property 》

[2-43] Invited Talk : Negative Thermal Expansion and Large Magnetic-Field-Induced Volume Change in Sintered Chromium Tellurides 《 Physical Property 》

[2-44] Invited Talk : Interplanar magnetic orders and symmetry-tuned zero thermal expansion in kagomé metal (Zr,Ta)Fe2 《 Synthesis Process, Physical Property 》

[2-45A] Negative thermal expansion accompanied by an electronic phase transition of double perovskite Pb2MgReO6 《 Synthesis Process, Physical Property 》

Authentication

[2-44] Invited Talk : Interplanar magnetic orders and symmetry-tuned zero thermal expansion in kagomé metal (Zr,Ta)Fe₂ 《 Synthesis Process, Physical Property 》

[2-45A] Negative thermal expansion accompanied by an electronic phase transition of double perovskite Pb₂MgReO₆ 《 Synthesis Process, Physical Property 》