[1P01-52] Poster Presentation

[1P44] Transient evolution of target erosion profile in high power pulsed magnetron sputtering processes

*Ren Mori¹, Md. Suruz Mian¹, Takeo Nakano¹ (1. Faculty of Science and Technology, Seikei University)

The evolution of the target erosion track profile was measured in high-power pulsed magnetron sputtering (HPPMS). The erosion track is a localized groove of the target surface inevitable with the magnetron sputtering and impacts the target's usage efficiency. In the previous study, we measured the profile evolution for DC sputtering and observed the difference in the normalized profile over time. In this study, sputter discharges were conducted using HPPMS, and the target surface profile was compared with DC cases with the same discharge condition and average power. The copper target was sputtered by HPPMS, and periodic measurements of the erosion profile were taken. Results indicated that the erosion track is wider in HPPMS compared to DC magnetron sputtering. It can be ascribed to the spatially spread instantaneous high-power discharge that escaped the confinement by the magnetron. It was also suggested that HPPMS had a smaller sputtering yield than DC.