AFFILIATED SYMPOSIA
Colleagues interested in running a thematic symposium are kindly asked to contact one of the conference chairs of the details of their symposium. Please also note that we have uploaded the following template for use for all future symposia.
List of Affiliated Symposia and Organizers’ Details:
1. Advances in Modeling, Characterization and Fabrication of Composite Materials
Organizer(s): S.A. Meguid
University of Toronto, Canada
E-mail: meguid@mie.utronto.ca
2. Experimental Mechanics and Instrumentation
Organizer(s): J.F. Silva Gomes
University of Porto, Portugal
E-mail: sg@fe.up.pt
3. Lightweight Design Technologies for Next-Generation Vehicles
Organizer(s): T. Matsumoto
E-mail: toshiro.matsumoto@mae.nagoya-u.ac.jp
4. Advances in Tribology Science and Engineering
Organizer(s): T. Tokoroyama and R. Zhang
Nagoya University
E-mail: noritsugu.Umehara@mae.Nagoya-u.ac.jp
E-mail: takayuki.tokoroyama@mae.nagoya-u.ac.jp
5. Additively Manufactured Materials: Production, Testing, Echo-
sustainability and Applications1. Advances in Modeling, Characterization and Fabrication of Composite Materials
Organizer(s): S.A. Meguid
University of Toronto, Canada
E-mail: meguid@mie.utronto.ca
2. Experimental Mechanics and Instrumentation
Organizer(s): J.F. Silva Gomes
University of Porto, Portugal
E-mail: sg@fe.up.pt
3. Lightweight Design Technologies for Next-Generation Vehicles
Organizer(s): T. Matsumoto
E-mail: toshiro.matsumoto@mae.nagoya-u.ac.jp
4. Advances in Tribology Science and Engineering
Organizer(s): T. Tokoroyama and R. Zhang
Nagoya University
E-mail: noritsugu.Umehara@mae.Nagoya-u.ac.jp
E-mail: takayuki.tokoroyama@mae.nagoya-u.ac.jp
5. Additively Manufactured Materials: Production, Testing, Echo-
Organizer(s): D. Croccolo and G. Olmi
University of Bologna
E-mail: dario.croccolo@unibo.it
E-mail: giorgio.olmi@unibo.it
6. Thematic symposium on Numerical Design/Simulation Methods and
Data-Driven Models for Advanced Structure and Mechanical
Metamaterials
Organizer(s): Y. Lian1, X. Zhang2, Z. Fu3, Y. Liang4 and Z. Du5
1Beijing Institute of Technology
2Tsinghua University
3Hohai University
4Xi'an Jiaotong University
5Dalian University of Technology
E-mail: yanping.lian@bit.edu.cn
E-mail: xzhang@tsinghua.edu.cn
7. Development of Medical Implants and Devices for Tissue
Integration:
Organizer(s): R. Mongrain1, S. Kobayashi2, M. Driscoll1
1McGill University
2Shinshu University
E-mail: rosaire.mongrain@mcgill.ca
E-mail: shukoba@shinshu-u.ac.jp
E-mail: mark.driscoll@mcgill.ca
8. Advanced Material Strength and Characterization Technology
Organizer(s): Y. Ju1, Y. Toku2
1Zhejiang University
2Nagoya University
E-mail: yang.ju@zju.edu.cn
E-mail: toku@nagoya-u.jp