[16] ソルダリング１

[16-77] The Characteristics and Reliability of Sn-In-Ag-Bi Solder Which Can Joint under 200℃

速報論文

^○Naomasa OKA, Tomoko NONAKA, Toru HAYASHIDA, Takashi SAITO, Mitsuhiro KOSAI (千住金属工業株式会社)

Keywords:Sn-20In、TCT、接合信頼性、析出強化、固溶強化