MRM2023/IUMRS-ICA2023

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Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

[G3-O503] Oral 503

Fri. Dec 15, 2023 4:30 PM - 6:30 PM Session 17 (Room 509)

Chair: Yu-An Shen (Feng Chia University)

4:30 PM - 4:50 PM

[G3-O503-01] Development of Ag-Si composite paste joining for high thermal
reliability in SiC power module

*Chuantong Chen1, Yang Liu1, Minoru Ueshima2, Koji Nakayama1, Katsuaki Suganuma1 (1. Osaka university (Japan), 2. Daicel Corporation (Japan))

Keywords:Ag-Si composite, Ag coarsening, grain structure, die-attach

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