[G3-O503] Oral 503

[G3-O503-01] Development of Ag-Si composite paste joining for high thermal
reliability in SiC power module

*Chuantong Chen¹, Yang Liu¹, Minoru Ueshima², Koji Nakayama¹, Katsuaki Suganuma¹ (1. Osaka university (Japan), 2. Daicel Corporation (Japan))

キーワード：Ag-Si composite, Ag coarsening, grain structure, die-attach