Interfacial Reaction between Electroplated Indium and Copper Substrate

Presentation information

Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

Fri. Dec 15, 2023 4:30 PM - 6:30 PM Session 17 (Room 509)

Chair: Yu-An Shen (Feng Chia University)

5:50 PM - 6:10 PM

*Yu-Hsin Lin¹, Fu-Ling Chang¹, C Robert Kao¹ (1. National Taiwan Univ. (Taiwan))

Keywords:low-temperature soldering, Cu-In intermetallic compounds, interfacial reaction, microstructure

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